One stop fully automatic packaging, cutting and forming separation system

Rib cutting forming separation system

Our company specializes in the research and production of semiconductor packaging post process equipment, integrating automatic packaging, rib cutting, forming, and separation solutions. The bare frame passes through an automatic lamination machine for whole mold lamination, and is transported to the plastic sealing mold through the feeding rack. After injecting black glue into the plastic sealing mold, the encapsulated product is obtained. Next, the glue machine removes excess residual glue to obtain the whole mold product. The product is electroplated and flows into the cutting rib and forming process.

The finished frame automatically passes through the cutting grip for loading, and is then placed on the punching track. It then enters the cutting mold and forming mold through the feeding machine, and after separating the mold, the finished product flows into the piping system to obtain the product.

IC Lead Frame

Semiconductor Plastic Packaging Mold

Automation Equipment

Cutting Reinforcement System

Company Advantages
Widely adopting advanced technology in the industry, keeping up with the times, continuously developing advanced manufacturing processes, prioritizing structural innovation, and developing efficient, long-lived, and high-precision molds and packaging equipment. We have been awarded the title of "High tech Enterprise" and have obtained multiple national patents, as well as internationally advanced processing equipment.
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Research And Development Advantages
We have over 50 research and development technicians, and the company has multiple technology patents. We have been awarded the titles of National High tech Enterprise and Shenzhen High tech Enterprise. Our core technology is at the forefront of the industry and we have core competitiveness.

Quality Advantage
The quality control department of Taijin Semiconductor has a comprehensive quality control process and strictly follows the quality inspection standards of each link, providing strong support for Taijin's production of high-quality plastic packaging equipment.

Manufacturing Advantages
The company has advanced manufacturing and processing capabilities in China, multiple CNC precision machining equipment, and a team of automation design experts and skilled and ingenious engineers.

Service Advantages
Professional mastery of user usage! Instant understanding of usage issues, timely resolution, product module design, replaceable. Adjustable, upgradable, and capable of providing long-term on-site debugging, installation and maintenance, training, and other work support for external engineers.
Taijin ▪ Processing Equipment
Focusing on semiconductor plastic packaging molds and cutting and forming system equipment
Semiconductor IC lead frame mold and plastic packaging automation equipment manufacturer consultation hotline: 13686286310

Guangdong Taijin Semiconductor Technology Co., Ltd. was established in 2010 and is a high-tech enterprise specializing in the research and development and production of semiconductor packaging process equipment. The main business scope includes: traditional molds, MGP molds, Auto Mold conversion parts, automatic unpacking glue channel machines, automatic pushing and lead frame machines, IC plastic sealing machines, IC sheet laying machines, IC cutting and forming machines, cutting and bending machines, spare parts for cutting and bending molds, semiconductor packaging molds, semiconductor cutting and forming machines, semiconductor automatic sheet laying machines, semiconductor rear packaging, semiconductor automation equipment, spare parts for plastic sealing molds R&D and manufacturing of automatic high-speed system equipment and components. Widely used in solid-state and liquid packaging of MicroLED&MiniLED in semiconductor discrete devices, capacitors, inductors, resistors, bridge circuits, automotive electronics, and the LED industry.