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IC Lead Frame


It is a metal sheet made of alloy materials that serves as a lead in electronic products, especially semiconductor integrated blocks, to connect external devices and internal parts. For the lead frame of integrated circuits, the more lead pins there are, the smaller the distance between the lead pins, and the stricter the requirements for the mold used to manufacture the frame. The shape of the lead frame is mostly crab shaped, and due to the many lead pins, the operation is difficult. Currently, high-speed press dies are commonly used to complete mold guidance. In the production of lead frame products, the main step is to design and manufacture the mold, which needs to consider multiple factors in combination with the product's purpose.