全自动高速切筋成型分离系统

全自动凸轮同步高速切筋成型分离系统


主要特点Features

设备功能:塑封后产品切脚折弯分离收集等 ;

冲切速度:120-180冲次/分钟(SPM:120-180)

适用封装:SOT/SOD/TSOT/SOP/SSOP/TSSOP/MSOP等IC、芯片半导体器件 ;

冲切动力:伺服马达上动力-3~5T;

控制系统:PLC(欧姆龙)

操作系统:触摸屏+操作按钮,显示UPH/SPM冲切数计数功能 ;

检测系统:进料及出料双镜CCD影像检测 ;

上料机构:旋转双弹夹上料 ;         

收料机构:料盒收料(散装)

安全保护系统:设备装有漏电保护装置、急停按钮装置及所有主要护门装有SENSOR保护装置,护门打开后系统应作一定的反应,以保护人身安全

选配1:CCD视觉检测装置;

选配2:MES系统联网功能;

优势

1.使用进口原材料,利用进口先进设备制造与检测,设备精度高,性能稳定;

2.按需定制,技术先进,使用寿命高,保证品质,负责安装调试,售后无忧。

Function: After plastic packaging, the product is cut and bent and collected separately.

Punching speed: 60~70 punching times/minute (SPM: 60~70)

Applicable packages: SOP/SSOP/TSSOP/MSOP and other series. 5. Punching power: servo motor.

Control system: PLC (Omron).

Operating system: touch screen + operation button, display UPH/SPM punching number counting function.

Detection system: double-mirror CCD image detection for incoming and outgoing materials.

Feeding mechanism: rotating double magazines for feeding.

Receiving mechanism: stacked tube trays automatically convert and receive materials (tube installation).

Safety protection system: The equipment is equipped with leakage protection device, emergency stop button device and all main guard doors are equipped with SENSOR protection. After the guard door is opened, the system should react to a certain extent to protect personal safety.


设备细节

IC切筋成型机 半导体切筋成型设备



样品展示

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